Chemical treatment & cleaning & drying in a single chamber
Compact design & high process flexibility
Low DIW & Chemical consumption
Critical process control



Classification Application Target
Cleaning Organic removal Pre cleaning
Post cleaning
D-sonic cleaning
Etching
/Strip		 Poly layer removal
Oxide layer removal
Photoresist removal		 Etch back
PR strip
Bevel cleaning Remove of Bevel area
0.5 ~ 5mm±0.1		 Poly layer removal
Oxide layer removal
Hybrid Multi-layer removal
Others Tungsten CEP
D-Cap
Cu cleaning, etc		 Post CMP cleaning
High etch-rate strip